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Instrument
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Description
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Equipment Location
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Operator'>TAU Faculty
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Academia
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Industry
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Operator
|
Faculty in Charge
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Contact email
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Contact phone
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Operator
|
Self
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FTIR PEM-IRAS (In Glove box Farm)
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PEM-IRAS for chamical analysis of surfaces located inside glove box
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The Center for Nanoscience and Nanotechnology
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$40
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$20
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$80 operator
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$150 operator
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Taly Fux
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MNCF Director
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griga@post.tau.ac.il
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03-6405713
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Ellipsometer Alpha SE (in Farm box farm)
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spectroscopic ellipsometer located inside glove box for thickness measurments
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The Center for Nanoscience and Nanotechnology
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$30
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$10
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$60 operator
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$120 operator
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Taly Fux
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MNCF Director
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griga@post.tau.ac.il
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03-6405713
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Probe Station
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2 probe stations for operation in ambient and in controlled eninroment conditions
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The Center for Nanoscience and Nanotechnology
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$30
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$20
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$60 operator
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$120 operator
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Gregory Avrushchenko
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MNCF Director
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griga@post.tau.ac.il
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03-6405713
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AFM NTMDT (In Glove box farm)
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AFM NTMDT SOLVER PRO P47H In A GLOVEBOX- AFM for environment and/or optically sensitive samples. This AFM is operated inside aglove-box with less than 0.1 ppm oxygen and water.
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The Center for Nanoscience and Nanotechnology
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$30
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$10
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$60 operator
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$120 operator
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Moshe Eliyahu
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MNCF Director
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mosheel@eng.tau.ac.il
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03-6405183
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Evaporator VST TFDS-870 (In Glove box Farm)
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The VST evaporator model TFDS-870 is a general purpouse deposition system for metallic layers on wafers, with sizes varing from 5" to pieces. It is equipped with 4 e-gun sources, 2 thermal sources, rotating sample holder, cooling & heating capabilities for the sample from liquid N2 to till 200°C .evaporated materials Au ,Ti , ,Ni ,Sio2 ,Al ,Pt , The system base pressure is 1.3x10-7 Torr.
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The Center for Nanoscience and Nanotechnology
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$85
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$50
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process dependent
|
process dependent
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Assaf Hazzan
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MNCF Director
|
oksman@eng.tau.ac.il
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036407926
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Instruments'>DWL 66 Laser Writer, Heidelberg Instruments
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Evaporator located inside glovebox equipped with thermal and ebaem evaporator
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Faculty of Engineering, Microfabrication facility
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mask dependent
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mask dependent
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mask dependent
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mask dependent
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Mark Oksman
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MNCF Director
|
oksman@eng.tau.ac.il
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036407926
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Karl Suss MA-6 Top side & back side Mask Alighner
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Special attachments include: Kammarath&Weiss Tensile system, NORDLYS II HKL electron backscattered diffraction (EBSD) system, and Oxford liquid nitrogen cooled Si EDS detector for element analysis.
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Faculty of Engineering, Microfabrication facility
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$75
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$50
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$105*
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$105
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Dr. Alex Gurevich,, David Schreiber
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MNCF Director
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oksman@eng.tau.ac.il
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036407926
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Karl Suss MJB 3 Mask Aligner
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Optical Mask Aligner, Wafers and pieces up to 3" diameter
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Faculty of Engineering, Microfabrication facility
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$75
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$50
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$105*
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$105
|
Dr. Alex Gurevich,, David Schreiber
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MNCF Director
|
|
036407926
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|
The Reactive Ion Etcher Nextral 860 is a High Density Plasma (HDP) reactor capable of dielectric etching for frontside de-processing, and of very fast etching for backside silicon thinning of packaged dies while maintaining full electrical functionality. In addition, the Nextral 860 HDP achieves excellent etch uniformity on 200 mm (8”) wafers. The system possible to etch SiO2, Si3N4, oxinitride, Si, TaN,TiN, Quartz, various polymer films
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Faculty of Engineering, Microfabrication facility
|
$75
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$50
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$105*
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$105
|
Dr. Alex Gurevich, Mark Oksman
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MNCF Director
|
oksman@eng.tau.ac.il
|
036407926
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Instrument
|
Description
|
Equipment Location
|
TAU Faculty
|
Academia
|
Industry
|
Operator__Faculty_in_Charge__Contact_email'>Operator
|
Faculty in Charge
|
Contact email
|
Contact phone
|
|
|
Operator
|
Self
|
|
|
Plasma therm SLR-770 ICP Deep Reactive Ion etcher
|
A 6" diameter inductive coupled plasma etch system, the Plasma Therm shuttlelock SLR 770 is configured with a load-lock capable of handling 3" to 6" wafers. It provides deep silicon trench etching through a licensed Bosch fluorine-based process. Full ranges of etch processes are available for all levels of MEMS, MOEMS and bio-MEMS device fabrication. Photonic crystalls etch process with nanometer resolurion developed by TAU is also available
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Faculty of Engineering, Microfabrication facility
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$75
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$50
|
160 operator
|
210 operator
|
Dr. Alex Gurevich, Mark Oksman
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MNCF Director
|
|
036407926
|
|
|
|
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Plasma Lab Reactive Ion etcher
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Simple RIE system for Glass, LiNbO3, SiO2 and Si3N4 and also photoresist plasma etching
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Faculty of Engineering, Microfabrication facility
|
$75
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$50
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$105*
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$105
|
Dr. Alex Gurevich
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MNCF Director
|
oksman@eng.tau.ac.il
|
036407926
|
|
|
|
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Plasma Preen microwave plasma etcher
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Simple Microwave plasma asher
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Faculty of Engineering, Microfabrication facility
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$75
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$50
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$105*
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$105
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Dr. Alex Gurevich
|
MNCF Director
|
|
036407926
|
|
|
|
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E-beam evaporator Edwards-306
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E-beam evaporator with 4 crucibles for evaporation of metallic and dielectric films
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Faculty of Engineering, Microfabrication facility
|
process dependent
|
process dependent
|
process dependent
|
process dependent
|
Dr. Alex Gurevich
|
MNCF Director
|
oksman@eng.tau.ac.il
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036407926
|
|
|
|
|
RF Diode Sputtering System MRC 8620
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RF sputtering system with 3 target holders. Metall and dielectric films deposition. Reactive sputtering with Nitrogen and Oxygen plasma is available. Substarte biasing possibility, also during sputtering process.
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Faculty of Engineering, Microfabrication facility
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$75
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$50
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process dependent
|
process dependent
|
Mark Oksman, Maurice Saidian
|
MNCF Director
|
|
036407926
|
|
|
|
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Ion Beam Sputtering System CSC Millatorn IV
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Ion -beam sputtering system with 4 target holders. Metal and dielectric film deposition with excellent quality and adhesion without substrate heating.
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Faculty of Engineering, Microfabrication facility
|
$75
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$50
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process dependent
|
process dependent
|
Mark Oksman, Maurice Saidian
|
MNCF Director
|
oksman@eng.tau.ac.il
|
036407926
|
|
|
|
|
Penta Vacuum RF/DC Sputtering System
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Sputtering system designed for deposition of common metals and insulators on substrates up to 6"diameter. A load-lock chamber and a deposition chamber . The system can operate in two modes: (1) serial sputtering where multiple-layers can be deposited one on top of the other; (2) co-sputtering mode where3 targets can simultaneously be deposited on the substrate.
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Faculty of Engineering, Microfabrication facility
|
$75
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$50
|
process dependent
|
process dependent
|
Dr. Alex Gurevich, Mark Oksman
|
MNCF Director
|
|
036407926
|
|
|
|
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PECVD OERLICON
|
The OERLICON -790 PECVD system is used to deposit dielectric films such as silicon dioxide, silicon nitride or SiOxNy.( in the installation process)
|
Faculty of Engineering, Microfabrication facility
|
TBD
|
TBD
|
TBD
|
TBD
|
Dr. Alex Gurevich, Mark Oksman
|
MNCF Director
|
oksman@eng.tau.ac.il
|
036407926
|
|
|
|
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PEO 603 Furnace, ATV
|
ATV PEO603 Vacuum Furnace for Si oxidation
|
Faculty of Engineering, Microfab facility
|
TBD
|
TBD
|
TBD
|
TBD
|
Mark Oksman, Maurice Saidian
|
MNCF Director
|
|
036407926
|
|
|
|
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Hisomet II measuring microscope
|
The Hisomet is a non-contact depth measuring microscope that has been designed based on the optical focal point detection system. Precise measurements of length and width are possible by Mitutoyo micrometric stage
|
Faculty of Engineering, Microfabrication facility
|
$75
|
$50
|
$105*
|
$105
|
all users
|
MNCF Director
|
oksman@eng.tau.ac.il
|
036407926
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