The use of ions generated by electron
-beam evaporation
for control of the
processes of heterostructure growth allows no additional source of ions in
molecular-
beam setups. Moreover, the use of ions from electron
-beam evaporators
for creation of multi-purpose
protective coatings significantly expands the
functional possibilities of electron-
beam evaporators and appropriate setups. The
proposed method and ion probe have no analogs in the world
and is fully
compatible with equipment of
molecular-
beam epitaxy. One of
the advantages
of the ion probe is
simplicity of its design.
Potentially this device can be
used for every high-vacuum and
ultrahigh-vacuum setups of
growth where there are electron-
beam evaporators.
Fig. 2.6. The dependence of of ion
current density on position along
moving ion probe
In the next sections the examples
of the observed effects and applications of the ion-stimulated methods are under
consideration.
2.2. Delta
-doping under ion-
stimulated deposition and estimation of distribution of
ion current density on substrate surface
Stibium
is a doping impurity of the
n
-
type for IV group elements. Its
segregation
behavior makes it a model material for surface segregation. Two
features of stibium is very important for the purpose of
this work. (i) For substrate
temperature of about
873К
the segregation length is so large that almost all the Sb
atoms segregate on the surface in Si epitaxy. (ii) The
Si ion flow builds the Sb
atoms from the surface into the epitaxial
n
-
type layer. This
method of doping is
called as doping with secondary ions (DSI) to differ it from direct injection of
doping impurity ions.
For relative measurements of the ion flow some amount of sub
-monolayer
coating of Sb adatoms (
0.
2 ×
monolayer (ML) =
1.
356×10
14
atom
∙
cm
-2
) was
evaporated from the Sb source onto the
p
-
Si
substrate surface 10-20
Ohm
·cm
heated up to
873К. Then the Si layers were grown from the partially ionized beams
without substrate rotation. The growth rate was
0.1 nm
/s. Since the silicon layers
were g
rown without substrate rotation, some
non-uniformity of doping on different
substrate parts was observed depending on their position relative to
electronic
evaporator position, as expected.
115
As a result of resistivity measurements by the four-
probe method,
the values
of the mean bulk concentration of impurities were defined at appropriate points
of the substrate surface.
The segregation length is defined by the following formula
,
(2.
3
)
where
n
s
is the surface concentration,
n
is the bulk one.
The change in concentration is defined by the formula
.
(2.
4
)
Integrating over thickness, we obtain
or
.
(2.
5
)
From there it is possible to find the segregation length ∆
if we know
n
(0)
.
The parameter
n
(0)
we can find from the following relation
(2.6)
where
S
is the cross section or area,
d
is the sample thickness,
N
is
the number of
impurity atoms in bulk.
N=
,
(2.
7
)
Here
d
N
=
n
(
z
)
S
d
z
, then
(2.
8
)
Substituting (2.
8
) in (2.6) we obtain
or
116
(2.
9
)
Substituting (2.
9
) in (2.
5
) we obtain
or
(2.
10
)
From there the segregation length is
(2.
11
)
With the values of
and
d = 3E
-5
cm
we define, according to (2.
11
), the
segregation length at appropriate points.
For delta
-
doping with ion participation one knows the following expression
that characterizes the concentration dependence of impurity atoms built into the
lattice on
ion floe density
(2.1
2
)
where
n
is the
bulk concentration of doping impurities,
R
is the growth rate,
F
ion
is
the ion flow,
σ
inc
is the cross section of Sb inbuilding,
n
s
is
the density of Sb
adatoms.
From (2.1
2
) it is possible to estimate the ion flow density as
or the ion current density
J
ion
=F
ion
q:
(2.1
3
)
where
q =1,6E
-19
C is the elementary charge. For
R=1E
-8
cm/sec;
σ
inc
=0,5E
-16
cm
2
(for 600 eV) and for
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