«интернаука» Научный журнал №8(231) Март 022 г. Часть Издается с ноября 2016 года Москва 2022 ббк 94 И73 Председатель редакционной коллегии: Еникеев Анатолий Анатольевич

Figure 1. (a) Graph of the number of articles published in Scopus (as of July 21, 2018) on various types of 
antimicrobial surface coatings (in relation to their main active ingredient) [6]. (b) A graph of patents granted 
between 2000 and 2019, obtained from the PatSnap database using the search query "antimicrobial copper coating" 
 
Antimicrobial activity of copper. 
To use the antimicrobial properties of copper, the 
surfaces that touch the skin and food must be made of 
copper or a copper alloy. This can be achieved by using 
solid copper equipment or by using copper surface 
spraying. The plasma sputtering process uses a DC elec-
tric arc to produce a stream of high-temperature ionized 
plasma gas, which acts as a sputtering heat source. The 
coating material, in the form of a powder, is transferred 
by an inert gas and injected into a plasma jet, where the 
powder melts and is ejected to the surface intended for 
spraying. 
Studies have shown that large amounts of copper 
ions were absorbed by E. coli in 90 minutes when the 
cells were applied to copper samples by means of an 
aqueous suspension (standing drop). When the cells 
were applied to copper using a minimum amount of 
liquid and with a drying time of 5 seconds, the accumu-
lation of copper ions by the cells was even more pro-
nounced, reaching a concentration in a fraction of a 
second. 
The level of copper ions in the cells remained high 
during the destruction phase, which suggests that the 
cells are suppressed by their intracellular copper [5]. 
The granular structure of copper matter affects the dif-
fusion of ions and thus contributes to the destruction of 
bacteria by copper ions. 
Galvanic method of copper plating of the surface
To use the antimicrobial properties of copper, the 
surfaces touching the skin and food must consist of 
copper or a copper alloy. 
This can be achieved by using solid copper equip-
ment or by means of a copper surface coating. In gen-
eral, for price reasons, copper coatings are preferable to 
a solid copper structure. There are various methods of 
spraying metal for applying a copper coating on devic-
es that can transmit microorganisms, therefore it is de-
sirable to establish the optimal method of spraying. 
Accordingly, three metal spraying techniques are eval-
uated in terms of the antimicrobial effect of the copper 
surface obtained through each of these techniques. 
Copper plating is the process of applying a thin layer 
of copper to the surface of an object. It is performed by 
the galvanic method, i.e. by transferring copper ions from 
a positively charged source to a negatively charged sur-
face to be treated. Most often, the process of electroplating 
copper is a preparatory stage before coating with nickel 
and chromium, but often copper plating of metal be-
comes an independent type of finishing. Electroplating 
is widely used, for which it is required to create a coat-
ing of copper. There are two options for copper plating 
at home: With immersion of the workpiece in the elec-
trolyte and without immersion. 
With immersion of the workpiece in the electro-
lyte. To perform the procedure, it is necessary to have a 
container with an electrolyte that has a sufficient vol-
ume. After preliminary preparation, consisting in 
cleaning the surface with sandpaper and washing in a 

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Журнал «Интернаука» 
№ 8 (231), 2022 г. 
7
hot soda solution, the object is connected to the nega-
tive electrode and immersed in the electrolyte for a 
certain time. 
Conclusion 
The results of the studies demonstrate the effec-
tiveness of the destruction of bacteria when using 
plasma spraying of copper. The plasma sputtering 
method precipitates molten particles at a relatively low 
speed (600 m / s). Thus, the Vickers hardness values 
for the copper coating obtained by plasma deposition 
were 94. Ionic diffusion in metals is enhanced by the 
presence of dislocations of particles, known as" diffu-
sion along dislocation lines", and ionic diffusion occurs 
mainly due to these dislocations.